Pervasive Computing — IoT, edge, cloud, data center, and back
Pervasive Computing, LG Electronics announces that it has closed its mobile business unit to focus on growth areas such as electric vehicle components, connected devices, smart homes, robotics, artificial intelligence, and business-to-business solutions, as well as platforms. forms and services. After exiting the market in July, the company will continue to update some high-end phones.
Intel has launched its third generation of Xeon Scalable x86 data center processors for data center, cloud, hybrid cloud, networking, and edge applications. The processor, called Ice Lake, includes Intel’s AI Accelerator DL Boost, additional security, and 5G features, as well as Intel’s Optane memory. Intel says it has so far shipped on a 200K chip.
proteanTecs is now a member of the Open Compute Project (OCP) community, which began with Facebook’s efforts to bring the industry together to address some issues with data center technology. “We are working closely with hyperscaleers, semiconductor companies, and system integrators to increase scalability in the cloud,” said Uzi Baruch, CSO at Proteintex. “By connecting to OCP, we will be able to make our roadmap better meet the needs of the industry and provide our expertise for the next generation of infrastructure.
In addition, proteanTecs introduced field monitoring of in situ chips in electronic devices. The monitoring uses the company’s Universal Chip Telemetry (CPU), which is built into the chips and distributes data about the operation of the chip. UCT will operate in the field in the first data center environment.
Datacenter operators will have access to data – including manufacturing data as well as field health data – but automotive and communications are also designed as markets for CPU in the field. “Converting data centers to a predictive strategy will allow them to deliver maximum dollars per GHz, detect failures early, optimize compute performance and provide instant visibility,” said Baruch.
AMD and Xilinx shareholders have voted to approve the proposed acquisition of Xilinx by AMD. The deal will bring together AMD’s processor, GPU with Xilinx’s adaptive FPGAs and SoCs. Xilinx invented the FPGA – Field Programmable Gate Array – in 1984. Even after regulatory approval, both companies expect the deal to be near completion by the end of 2021.
Taal has driven its digital 20.1 below 4nm using advanced process technologies from Samsung Foundry. “With continued innovation in hyper-scale computing and autonomous driving, there is an increasing demand for HPC capabilities,” says a press release from Samsung Electronics. “By combining the latest Samsung Foundry advanced process nodes with the Rhythm 20.1 Digital Full Flow, our customers can achieve their design goals quickly and efficiently.”
Synopsys has announced its prototype HAPS-100 system, which is part of the Synopsys Verification Continuum platform. Prototyping systems combine debugging enhancements with additional speeds for software development and system validation times, up to 20–50 MHz for complex SoCs and up to 500 MHz for interface IPs. Synopsys states that increased speed and debugging were needed in various markets, including automotive.
Security Annotations for Electronic Design Integration (SA-EDI) Draft Standard 1.0 for Public Review is a standard for IP hardware and software security managed by the IP Security Assurance Working Group of the Accelera Systems Initiative (Accelera). The standard aims to create ways to secure low-cost, non-disruptive, and scalable IP addresses. The public review continues until May 21, 2021. Download the draft standard here.
The Semiconductor Industry Association (SIA) has urged the U.S. government to take more action to strengthen semiconductor supply chains in support of the recent executive order of the U.S. president.
Siemens announced software for printed circuit board (PCB) design approval as a design tool (SaaS), which can test designs with manufacturers to help manufacturers avoid costly mistakes. This software, called PCBflow, is an extension of the Siemens Xcelerator portfolio.
ROHM Semiconductor Europe has appointed Wolfram Harneck as the new president of the company.
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